QFN Tape (Acrylic PSA)
high-temperature resistant,Plasma Clean and no silicon precipitation problems
Good stability,flatness, residue free after removal at high temperature
Used in QFN molding process before Wire bond
Material Thickness(µm) | Thickness(mm) | 180° Peel Adhesion (kg/inch) | Adhesive Base | Temperature Range(°C) |
25 | 0.032 | 0.2↓ | Acrylic | 180 ℃× 0.5HR |
QFN Tape (Silicone PSA)
Good stability,flatness, residue free after removal at high temperature
Used in QFN molding process, to avoid EPOXY bleeding.
Material Thickness(µm) | Thickness(mm) | 180° Peel Adhesion (kg/inch) | Adhesive Base | Temperature Range(°C) |
25 | 0.036 | 0.15↓ | Silicone | 180 ℃× 0.5HR |